Course:MTRL466-adhesivebonding/Group2/November 4

Project Name	Adhesive Bonding
Group	2
Current Meeting	November 4, 2011
Minutes Prepared By	Mandy Chen

Attendees

Chad, Mandy, Shauna, Zoe, Andy and Kyle

Minutes

Midterm Report

• Flow/Organization
• Adhesive bonding is in need and constraint and lit review- overlap
• Lead-ins/introductions!
• Need and constraint
  • Talk about why building process models
  • Specific need in what we are doing
  • Need: 3 steps of models
• Problem specification
  • Constraints: Missed a bunch
  • Objective: Be more specific (Products coming out of facility/time)
• Literature review- reference!

Adhesive bonding

• Validation done

Heat transfer

• Need a model to find out the heat transfer to each material because our materials are sensitive to temperature
• Explain the logic
• Explain the limitation of explicit finite difference- time step

Recovery

• Assume linear fit between v and T- not physical reason to why v is a function of T
• Explain that we don't know the relationship for lower temperature- need more time
• Strain is also a function of time
  • Check v at 0.58 and 1.03. At 50% reduction, what is the time difference between the prestrain?

Optimization

• alpha >= 0.9 (Alpha peak)
• Sigma6000 >= 0.9 (sigma peak)
• Sigma5000 >= 0.9 (Sigma original)
• First time step- quickest way to reach
• Constraint: Paint bake- time and temperature

Economic analysis

• estimate how much saving- energy and time
• decrease process cycle time
• How many more vehicles?
• How much money?
  • Decrease time and fewer resources?
• Capital cost of paint bake booth
  • Surrey paint bake booth
• Capital cost reduction?
• Electricity reduction?
• How many paint booths?

Agenda

• Kyle will lead the meeting
• Communicate on the progress of each model, model intergraton, and process optimization
• Get feedback from Chad and dicide future steps

Heat Transfer

• Finished the model validation under both the Newtonian and non-Newtonian conditions.

Precipitation Hardening

• Validated the model with the temperature profile given by the heat transfer model at 4 oven temperatures and 1 h.

Model Optimizaiton

• Formulated procedures for optimization
• waiting for the combined model
• Researching on energy cost --- need data from GM

Future Plans

• Economic Analysis*
• Finding h and Tsurface for Adhesive curing, 5000 strength and 6000 strength